MJ 3D BGA Reballing Stencil template for iPhone A8 A9 A10 groove tin Steel

MJ 3D BGA Reballing Stencil template for iPhone A8 A9 A10 groove tin Steel
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MJ 3D BGA Reballing Stencil template for iPhone A8 A9 A10 groove tin Steel

  • History: 13 Orders
  • Shipping Weight: 0.015kg
  • Units in Stock: 9984
  • Model: VC884
(Shipped from China. Complete the orders At today. Deliverd around 29/06/2017)

Price:   $23.99  $18.9921% off

Please Choose:

  • Optional 1
  • Optional 2
  • Optional 3

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    All programmer have 1 year warranty
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    New patented BGA rework stencils: MJ 3D BGA Reballing Stencil template, iPhone A8 A9 A10 groove Reballing Stencil Template, iphone 6/6 plus, iphone 6s/6s plus and iphone 7 /7plus 3D BGA Reballing Stencil template.



    New patented groove BGA rework stencils: MJ 3D BGA Reballing Stencil template

     New Style 3D BGA planting Stencil: 
    Stepped groove /  easy to use / Accuratea Lignment

    1.Stepped groove design enables stencil to align with tinning position of IC rapidly.
    2.The square holes design makes it easier to take out the formed solder balls.
    3.This 3D stencil is easy to use no matter you are a new or expert.
    4.High success rate of planting tin,the solder balls can be formed once after you are proficient.
    5.This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
     

    groove (Automatic counterpoint) Reballing Stencil Template for iphone A8 A9 A10 

    groove Reballing Stencil Template 


    Optional 1:  MJ 3D A8
    Optional 2:  MJ 3D A9
    Optional 3:  MJ 3D A10

     

    MJ 3D A8:  iphone 6/6 plus IC: Touch IC, Baseband, font IC, audio IC, power IC, A8 CPU


    MJ 3D A9: iphone 6s/6s plus: Touch IC, Baseband, font IC, audio IC, power IC, A9 CPU


    MJ 3D A10: iphone 7 /7plus: Touch IC, Baseband, font IC, audio IC, power IC, A10 CPU


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