Mobile Phone Repair Tools and Replacement Accessories: will help you get many Smart Phone Repair Tool...
Mobile Phone Repairing Machines, These range from simple level repair tools to professional-grade tools to...
Mobile Phone Repair Consumables Solder Wire / Solder Paste / Flux Solder / Solder Iron Tip / Tin absorption...
Do you find Soldering Station and Soldering Irons Accessories for cell phone repair? we offer china brand Soldering Tool and Desoldering...
China PhoneFIX wholesale Trinocular Microscope for primary cell phone PCB Soldering repair and board level repair, when you confuse to select...
Phone Replacement Parts: iPhone / iPad / others Cell phone Replacement Parts
a...
Find car & truck Car performance chips, Buy online Car ECU chip for your car such as ECU chips & Ignition IC & Dashboard mileage IC...
With our large selection of universal programmer devices, we can offer you best universal programmer solution. To make it easier for you...
Universal Programmer Adapters and IC Sockets, All programmers come with ZIF (Zero Insertion Force) sockets for...
2022 JY02 Grinder CNC Grinding Machine for iPhone 6-13 Pro Max motherboard PCB BGA CPU IC grinding removal. JY02 CNC Grinding Machine for iPhone motherboard hardware iCloud unlock, touch screen control panel disassembly. JY02 CNC Grinder is used to grind and remove the CPU, Baseband, Nand flash, WIFI, FONT chips in iPhone logic board without any damage. JY02 Intelligent Grinding Machine is the upgraded version of JY01.
Options:
1. JY02 standard set: iPhone 6-X mold, grinding blade(50pcs/box),1xSD card,1x blow dust ball.
2. XS Mold.
3. XS MAX Mold.
4. XR Mold.
5. 11 Mold.
6. 11 Pro/11 Pro Max mold.
7. 12/12 mini mold.
8. 12 Pro/12 Pro max mold.
9. 13/13mini mold.
10. 13 Pro/13 Pro Max mold.
Features:
1. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing.
2. Touch screen control panel, this machine is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6 6P 6S 6SP 7, 7P. 8 8P X
When use BGA rework station or desoldering station
BGA chip is difficult to be removed as solder ball melts but glue didn't.
Uneven heat will damage the surrounding chip and PCB layers, heat especially will melt surrounded BGA chip’s solder point and cause short circuit.
When use CNC phone IC grinding machine :
We can engraving the whole chip and show the PCB pads.
PCB and chip may have tilt angle, it cause the engraving difficult to just cut a flat area, our smart IC remover has detector to check 4 corners of chip before engraving, we can then calculate the chip’s tilt angle.
Work without PC, just control the LCD touch screen we can easy to remove BGA chip.
No need to do glue removing.
Highlights :
No need programming, entered already.
Do not need computer.
Solves the problem of chip’s tilt angle.
Size error polished problem solved, automatically set the size of the chip out of the tool path, support manual settings under the knife depth and coordinates.
Smart SD card to store data, a full range of Apple IC home position, the chip grinding parameters have been set already, free update.
Monitor tool wear by pressure,
Knife pressure spindle overrun, protect board.
Y axis pinch hand function.
Automatically emergency alarm.
Eight templates, a full range of iPhone original board IC, unlimited upgrades
Automatic cleaning system. (included)
HD camera (included), can manually focus, distinguish polished IC level, monitoring add depth.