XINZHIZAO X360II Intelligent Heat Table Weld Platform For IPhone X-13 PRO MAX Dot Matrix Prejector Motherboard Layer Fix. XINZHIZAO X360II intelligent preheating platform for iPhone X-13 Pro Max motherboard, A8-A14 CPU, Face ID, Android Phone motherboard. X360II motherboard layered heating platform for iPhone motherboard separation or fit.

Features:
1. No damage to the motherboard, intelligent digital display, precise temperature control.
2. The module is equipped with positioning posts, which can be accurately separated and attached to the main board.
3. Fast heating, long life, fast heat compensation speed and low power consumption.
4. Adjustable digital tube temperature display, can observe the current heating temperature in real time, making maintenance and desoldering easier and more convenient.
5. Support modular expansion, modules can be switched at will, support X-12PROMAX separation and bonding.

Product information:
Brand: XINZHIZAO
MODEL: X360II intelligent heating platform
Material: Synthetic stone
Power: 110V/220W
Voltage: 110V/220V
SIZE: 148*128*48MM
Temperature: 50-260 degrees
Models available: iPhone X-12 PRO MAX, Android motherboard, A8-A13 CPU, Face ID.

Package list:
Package 1:
X360II Host + Universal Platform
1PCS X/XS/XSM module
1PCS 11/11P/11Max module

Package 2:
X360II Host + Universal Platform
1PCS 12mini module
1PCS 12/12P/12Max module

Package 3:
X360II Host + Universal Platform
1PCS X/XS/XSM module
1PCS 11/11P/11Max module
1PCS 12mini module
1PCS 12/12P/12Max module

Package 4:
X360II Host + Universal Platform
1PCS X/XS/XSM module
1PCS 11/11P/11Max module
1PCS 12mini module
1PCS 12/12P/12Max module
1PCS dot matrix module

For X-13PM + Face ID mold:
1x X360II Host
1x Universal Platform
1x iPhone X/XS/XSM mold
1x iPhone 11/11P/11PM mold
1x iPhone 12mini mold
1x iPhone 12/12P/12PM mold
1x iPhone 13/13mini mold
1x iPhone 13/13PM mold
1x iPhone Face ID Dot projector mold