Mobile Phone Repair Tools and Replacement Accessories: will help you get many Smart Phone Repair Tool...
Mobile Phone Repairing Machines, These range from simple level repair tools to professional-grade tools to...
Mobile Phone Repair Consumables Solder Wire / Solder Paste / Flux Solder / Solder Iron Tip / Tin absorption...
Do you find Soldering Station and Soldering Irons Accessories for cell phone repair? we offer china brand Soldering Tool and Desoldering...
China PhoneFIX wholesale Trinocular Microscope for primary cell phone PCB Soldering repair and board level repair, when you confuse to select...
Phone Replacement Parts: iPhone / iPad / others Cell phone Replacement Parts
a...
Find car & truck Car performance chips, Buy online Car ECU chip for your car such as ECU chips & Ignition IC & Dashboard mileage IC...
With our large selection of universal programmer devices, we can offer you best universal programmer solution. To make it easier for you...
Universal Programmer Adapters and IC Sockets, All programmers come with ZIF (Zero Insertion Force) sockets for...
LGA52 LGA60 Apple iphone / ipad NAND flash memory chip test socket, iPhone 4/4S/5/5C 5S 6 6plus, iPad 2/3/4 mini 234 air 23 NAND Flash test socket jig fixture, changing iphone serial number with FPC.
Support Testing big or small 3.1/3.2 HDD 12*17 and 14*18 NAND flash memory chip, changing iphone / ipad Nand serial number with FPC
ipad / iphone LGA52 LGA60 NAND flash memory chip test socket & iphone NAND Flash Test jig fixture, changing iphone serial number with FPC, support big / small HDD
Features:
1. Pogo Pin Solution: beryllium cuprum(standard).
2. Special probe head can stab the oxidation layer of the solder, assuring stable contact and not damaging the solder ball
3. Adopting Torlon As The Insulation Material. Engineering Material.
4. Compatible With LGA60, LGA52 Nand Flash, IC Size:14 X 11,17 X 12,17 X 13,18 X 13,18 X 14,20 X 12mm.
5. Accurate Positioning On Test Pad or Solder Ball.
6. Long Life Usage(50,000 times), High Quality and Stable Performance.
7. Pressure Ajustable Design So As To Compatible With IC Thickness From 0.8-1.5mm.
8. Realization Of Reading and Access The Data Of NAND Flash-eMMC.
9.Compatible With Samsung,Hynix,Sandisk,Toshiba,Intel,etc eMMC chip.
10: Feature: Manual Clamshell, easy to operate.