Mechanic 3D middle layer stencils for iPhone 12/12 Pro/12 Pro Max/12 mini motherboard soldering repair. Mechanic 3D-12 Pro reballing stencil steel mesh for iPhone 12/12 Pro middle layer. Mechanic 3D-12 Mini reballing stencil steel mesh for iPhone 12 mini middle layer. Mechanic 3D-12 PM reballing stencil steel mesh for iPhone 12 Pro Max middle layer. 

Option:
1. 3D-12 Pro: for iPhone 12/12 Pro motherboard middle layer frame. 
2. 3D-12 mini: for iPhone 12 mini motherboard middle layer frame. 
3. 3D-12 PM: for iPhone 12 Pro Max motherboard middle layer frame. 

Product Features:
3D groove etching process: Universal material thickness 0.3mm groove etching thickness 0.15, reballing thickness 0.15mm. Take off the stencil to planting, prevent stencil from bulging.
Square hole for planting stencil: The distance is exactly the same, and planting balls better.
Round and full as a pearl: The tin ball bright, full and uniform.
Imported with original packaging: Original imported T0.12AAA level material, good toughness, strong hardness, high temperature resistance 585℃, no bulge, high flatness, not easy to deformation.
Double-sided positioning design: Tin planting on the upper and lower layers of the main board, degumming

Product Specification :
Item Name: 3D-12Pro Reballing Stencil
Brand: Mechanic
Model: 3D-12Pro (12 Pro A/B)
Product Size: 77*35*0.12mm
Packing Size: 95*63*14mm
Net Weight: 6g