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    Home/ Soldering Tools/ PCB Pre-Heating Tool/ SS-T12A iPhone Motherboard CPU Desoldering Pre-heating station
  • SS-T12A iPhone Motherboard CPU Desoldering Pre-heating station

    • Model: SS-T12A
    • Shipping Weight: 0.1kg
    • History: 115 Orders

    Price:   Starting price at: $1.59

    (23reviews)

    Please Choose:

    • SS-T12A Heating Station ( +$27.55 ) (+0.4kg)
    • without main unit
    Added function






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    (Shipped In 48hours. Tracking Provided. Estimated Delivery on 01/02/2021)
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    SS-T12A Heating Station with different iphone Motherboard Heating groove, T12A-X T12A-XS T12A-XSM  iphone X XS MAX Double Layers Board Pre-heating Rework Station, iphone 5S 6 7 motherboard desoldering station, SS-T12A Heating Station for iphone 6 7 8 X XS MAX motherboard desoldering repair.


     

    1pcs SS-T12A Heating Station Main Unit come with T12A-X3 / T12A-CPU / T12A-F/ T12A-Face ID/ T12-andriod Motherboard Heating groove


    SS-T12A Heating Station Main Unit + Five kinds Motherboard Heating groove:

    • T12A-X3 for X / XS / XMAX
    • T12A-CPU
    • T12A-F
    • T12A-Andriod
    • T12A-Face ID 

      Added T12A-N11 for iphone 11 pro max motherboard


    SUNSHINE SS-T12A iPhone X upper / lower motherboard pre-heating station adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. SS-T12A has dual bayonet design to make iphone X motherboard stable. SUNSHINE SS-T12A has EU, AU, and US plug, 110V or 220V for your choice. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear


    100V-240V SS-T12A iPhone X mainboard stratified 185 degrees accurate rapid separated disassembly heating station


    iPhone X logic board was folded in half, two layers then were soldered together, the upper layer is the mainboard, and the lower layer is the signal board. Which made our repair much difficult to proceed, how to repair iPhone X logic board in fast and efficient method, need the professional iPhone X motherboard repair tools


    Features
     

    1. Adopting 185-degree layered process to remove the IP-X motherboard, not only from our fine analysis of IP-X solder paste ,but  depends on the special heating design and precise temperature control of SS-T12A.
    2. SS-T12A only heats the area that the IP-X board needs to be removed to prevent improper heating.
    3. Dual bayonet design, make sure the IP-X motherboard is stable on the stage.
    4. High purity copper is used as a film to ensure uniform heat transfer and heat.


    Please tell us what you think and share your opinions with others. Be sure to focus your comments on the product.




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